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	PRODUCT DATA of Eccobond Solder 56C

Material	Eccobond Solder 56C
Product Datasheet	ECCOBOND56C
Product Type	Electrically-conductive adhesive paste
Chemical Composition	Epoxy-Silver-loaded
Name of Manufacturer	Emerson & Cumming

	EXPERIENCE IN PRACTICE

Development Status	Commercial product
Cost Range	high
Lot Reproducibility	Excelent
Space Experience	Extensive

	ELECTRICAL PROPERTIES

Electrical Volume Resistivity

2 x 10-6 ohm.m

	THERMAL PROPERTIES

Thermal Conductivity	5.8 W/m.K Data Quality: Manufacturer's data
Thermal Expansion Coefficient	36 μstrain/°C Data Quality: Manufacturer's data

	RELEVANT PROPERTIES FOR USE IN SPACE COMMUNITY

Flammability	Pass (23.8% O2) Test: NASA NHB 8060-1B
Toxicity/Offgassing	Pass Test:NASA NHB 8060-1A
Temperature Range(space)	-60°C to +175°C. Data Quality: Manufacturer's data
Outgassing	TML = 0.30%, RML =0.20%, CVCM = 0.02% Test: ECSS-Q-70-02

	SPECIAL RECOMMENDATIONS

Special Recommendations

Recommended proportions are: 100 pbw resin + 2.5 pbw catalyst 9. Recommended cure is 16 hours at 50°C. Peel strength of this adhesive is low. Cycling to subzero temperatures can be detrimental. Electrical bonds made with this adhesive to metals having a different EMF are likely to degrade in a humid environment, particularly if the metal layers are thin (e.g. vacuum deposits). Different catalysts are available which will affect the properties, including temperature range and processing recommendations. Space experience with catalysts 9 and 11 is available.